The goal of this work is, in connection with the increasing demand of high transparent polymers or polymer compounds in fields of industrial manufacture like optics and optoelectronics, to discuss and disclose the interface interactions between different amorphous substrate materials and copper. In realization of this objective the plasma-solid state-interface interaction was investigated for low-pressure plasma pre-treatment, deposition of organic (plasmapolymeisation) and inorganic adhesive layer promoting adhesion enhancement. The contribution of different physical vapour deposition (PVD) techniques- sputtern and evaporation was studied and discussed. The emphasis and the most important aspect of this study are by the interface analysis. As representative for transparent amorphous polymers two types of cycloolefin copolymer (COC) and one type of polycarbonate (PC) were studied. In this way the influence of the different chemical structure of the substrate on the adhesion was taken into account. This comes especially positive by COC-Cu-compound, whereas by PC-Cu-compound a poor interaction was observed. Generally, it was established, that the same pre-treatment of COC and PC as substrate materials causes different results. Consequently, this factor must be taken into account by manufacture of adherent (amorphous) polymer-Cu-compounds, despite the higher cost of COC.